| Article | illustrate | Expiration Date |
| 7(a) | Lead in high melting point solders (i.e. lead-based alloys containing 85% or more lead). | For all categories (excluding applications covered by item 24 of this Annex): December 31, 2026. |
| 7(a)-I | Lead in high melting point solders (i.e. lead-based alloys containing 85% or more lead) used for connecting chips or internal interconnections of chips and other components in semiconductor assemblies, with steady/transient pulse currents of 0.1 A or greater, blocking voltages exceeding 10 V, or chip edge dimensions greater than 0.3 mm x 0.3 mm. | For all categories (excluding applications covered by item 24 of this Annex): December 31, 2027. |
| 7(a)-II | Lead in high melting point solders (i.e. lead-based alloys containing 85% or more lead) for integral (i.e. internal and external) connections for die attach in electrical and electronic components, if all of the following conditions are met: - thermal conductivity of the cured/sintered die attach material >35 W/(m*K); - electrical conductivity of the cured/sintered die attach material >4.7 MS/m; - solidus melting temperature above 260°C. | For all categories (excluding applications under item 24 of this Annex): December 31, 2027. |
| 7(a)-III | Lead in high melting point solders (i.e., lead-based alloys containing 85% or more lead) is used to make first-level solder joints (internal or bulk connections - i.e., internal and external) on components, with subsequent second-level soldering used to mount the electronic component to a subassembly (i.e., module, sub-board, substrate, or point-to-point soldering) without reflow of the first-level solder. This sub-item does not include die attach applications and encapsulation. | For all categories (excluding applications under item 24 of this Annex): December 31, 2027. |
| 7(a)-IV | Lead in high-melting-point solders (i.e., lead-based alloys containing 85% or more lead) is used for secondary solder joints connecting components to printed circuit boards or lead frames: 1. For connecting the solder balls of ceramic ball grid arrays (BGAs); 2. For high-temperature plastic overmolding (> 220°C). | For all categories (excluding applications covered by item 24 of this Annex): December 31, 2027. |
| 7(a)-V | Lead in high-melting-point solders (i.e., lead-based alloys containing 85% or more lead) is used as hermetic sealing materials for the following components: ceramic packages or plugs and metal housings; component terminals and internal subassemblies. | For all categories (excluding applications covered by item 24 of this Annex): December 31, 2027. |
| 7(a)-VI | Lead in refractory solder (i.e., lead-based alloys containing 85% or more lead) is used to establish electrical connections between lamp components in incandescent reflector lamps for infrared heating, high-intensity discharge lamps, or oven lamps. | For all categories (excluding applications under item 24 of this Annex): December 31, 2027. |
| 7(a)-VII | Lead in high-melting-point solders (i.e., lead-based alloys containing 85% or more lead) is used in audio sensors with peak operating temperatures exceeding 200°C. | For all categories (excluding applications under item 24 of this Annex): December 31, 2027. |
