| 33. 电源变压器中，用来焊接细铜线(直径等于或小于100μm)的焊料中所含的铅。 | 33.Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers. |
| 34. 金属陶瓷微调电位器元素中的铅。 | 34.Lead in cermet-based trimmer potentiometer elements. |
| 35. 专业音响设备中，光偶合器的光阻内所含的镉。此项豁免于2009年12月31日截止。 | 35.Cadmium in photoresistors for optocouplers applied in professional audio equipment until 31 December 2009. |
| 36. 直流电浆显示器中，用作阴极溅镀抑制剂的汞，每台显示器的含量不得大于30毫克。 | 36.Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display
until 1 July 2010. |
| 37. 以硼酸锌盐玻璃为基底，高压二极体电镀层中所含的铅。 | 37.Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body. |
| 38. 用于铝及氧化铍接合的厚膜涂料中所含的镉和镉氧化物。 | 38.Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide. |
