| 5(a) | Lead content in the glass of cathode ray tubes | Failure | Failure | Failure | efficient(Until July 21, 2024) | efficient(Until July 21, 2024) |
| 5(b) | Lead content in glass of fluorescent tubes not exceeding 0.2% by weight | Valid (extension applied for) | Failure | Failure | efficient(Until July 21, 2024) | efficient(Until July 21, 2024) |
| 7(b) | Lead in solders used in servers, storage and storage array systems, and in network infrastructure equipment used for switching, signal generation and transmission, and telecommunications network management | Failure | Failure | Failure | efficient(Until July 21, 2024) | efficient(Until July 21, 2024) |
| 7(c)-IV | Lead in PZT dielectric ceramic materials used in capacitor components of integrated circuits or discrete semiconductors | Failure | Failure | Failure | efficient(Until July 21, 2024) | efficient(Until July 21, 2024) |
| 9 | Hexavalent chromium as a corrosion inhibitor in carbon steel cooling systems in absorption refrigerators not exceeding 0.75% by weight | Failure | Failure | Failure | efficient(Until July 21, 2024) | efficient(Until July 21, 2024) |
| 9(b) | Lead in bearing shells and bushings in refrigerant-containing compressors in heating, ventilation, air conditioning and refrigeration (HVACR) equipment | Failure | Failure | Failure | efficient(Until July 21, 2024) | efficient(Until July 21, 2024) |
| 17 | Lead halogens used as energizers in high-intensity discharge (HID) lamps used in professional reprographic equipment | Failure | Failure | Failure | efficient(Until July 21, 2024) | efficient(Until July 21, 2024) |
| 18(b) | When discharge lamps are used as tanning lamps containing phosphors, such as BSP (BaSi2O5:Pb), the lead content of the phosphor catalyst in the discharge lamp is 1% by weight or less. | Valid (extension applied for) | Valid (extension applied for) | Failure | efficient(Until July 21, 2024) | Valid (extension applied for) |
| 21 | Lead and cadmium in printing inks used on glass enamels, such as borosilicate glass and alkali-lime glass | Failure | Failure | Failure | efficient(Until July 21, 2024) | efficient(Until July 21, 2024) |
| 24 | Lead in solders for through-hole discoidal and planar array ceramic multilayer capacitors | Valid (extension applied for) | Valid (extension applied for) | Valid (extension applied for) | Valid (extension applied for) | efficient(Until July 21, 2024) |
| 25 | Lead oxide used in surface conduction electron emitter display (SED) components, especially in encapsulation glass and ring glass | Failure | Failure | Failure | efficient(Until July 21, 2024) | efficient(Until July 21, 2024) |
| 29 | Lead in crystal glass as defined in Annex I (Categories 1, 2, 3 and 4) to Council Directive 69/493/EEC | Valid (extension applied for) | Failure | Failure | efficient(Until July 21, 2024) | Valid (extension applied for) |
| 30 | Cadmium alloys in solders used for electrical or mechanical welding of electrical conductors directly to the voice coil of high-power loudspeaker transducers with a sound pressure greater than or equal to 100 decibels | Failure | Failure | Failure | efficient(Until July 21, 2024) | efficient(Until July 21, 2024) |
| 31 | Lead in soldering materials in mercury-free flat fluorescent lamps (e.g. for liquid crystal displays, design or industrial lighting) | Failure | Failure | Failure | efficient(Until July 21, 2024) | efficient(Until July 21, 2024) |
| 32 | Lead oxide in sealing glass for argon and krypton laser tubes in window assemblies | Valid (extension applied for) | Valid (extension applied for) | Failure | Valid (extension applied for) | efficient(Until July 21, 2024) |
| 33 | Lead in solders used for soldering thin copper wires with a diameter of 100 microns or less in power transformers | Failure | Failure | Failure | efficient(Until July 21, 2024) | efficient(Until July 21, 2024) |
| 37 | Lead in the electroplated coating of high-voltage diodes based on zinc borate glass | Failure | Failure | Failure | efficient(Until July 21, 2024) | efficient(Until July 21, 2024) |
| 38 | Cadmium and cadmium oxide in thick film pastes for use on aluminum-bonded beryllium oxide | Failure | Failure | Failure | efficient(Until July 21, 2024) | efficient(Until July 21, 2024) |
| 41 | Lead in solders and terminal treatments, and in surface treatments of printed circuit boards, for electrical and electronic components used in ignition modules and other electrical and electronic engine control systems that must for technical reasons be mounted directly on the crankcase or cylinder of portable internal combustion engines (classified as SH:1, SH:2 or SH:3 in Directive 97/68/EC of the European Parliament and of the Council) | Failure | Failure | Failure | efficient(Until July 21, 2024) | Failure |
| 43 | Bis(2-ethylhexyl) phthalate in rubber parts designed for use in engine systems in equipment not intended for consumer use only, not intended for prolonged contact with human mucous membranes or human skin, where the concentration of di(2-ethylhexyl) phthalate does not exceed: (a) 30% by weight of the rubber for (i) gasket coatings, (ii) solid rubber gaskets, or (iii) rubber parts connected to an engine and consisting of at least three components that are operated by electrical, mechanical, or hydraulic energy. (b) 10% by weight of the rubber for rubber parts not specified in (a). For the purposes of this entry, "prolonged contact with human skin" means continuous contact exceeding 10 minutes or intermittent contact exceeding 30 minutes per day. | – | – | – | – | efficient(Until July 21, 2024) |
