EU announces RoHSExemption item modification instructions and new exemption item instructions
The European Commission announced resolutions on June 4 and 10, 2009 respectively.2009/428/ECand2009/443/EC, modify the RoHS Directive (2002/95/EC). 2009/428/EC modified the 22nd exemption provision, and 2009/443/EC added six new exemptions for lead, cadmium and mercury.
After sufficient scientific and technical assessment, the Committee concluded that there are already rare earth iron garnet (RIG) Faraday spinners that comply with the lead content limits of the RoHS Directive (2002/95/EC), so this exemption should be reconsidered. Therefore, 2009/428/EEC changes item 22 to:
22. Lead as an impurity in rare earth iron garnet (RIG) Faraday rotators used in optical fiber communication systems will be exempted from
Ending on December 31, 2009. (Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fiber optic communication systems until 31 December 2009.')
Six new RoHS exemptions were added to Directive 2009/443/EC, and their applications are:
33. Lead contained in the solder used to weld thin copper wires (diameter equal to or less than 100 μm) in power transformers. (Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers.)
34. Lead in cermet trimmer potentiometer elements. (Lead in cermet-based trimmer potentiometer elements.)
35. Cadmium contained in the photoresist of optical couplers in professional audio equipment. This exemption expires on December 31, 2009. (Cadmium in photoresistors for optocouplers applied in professional audio equipment until 31 December 2009.)
36. In DC plasma displays, the content of mercury used as a cathode sputtering inhibitor shall not exceed 30 mg per display. (This exemption expires on July 1, 2010. (Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display
until 1 July 2010.)
37. Lead contained in electroplating layers of high-voltage diodes based on zinc borate glass. (Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body.)
38. Cadmium and cadmium oxides contained in thick film coatings used for joining aluminum and beryllium oxide. (Cadmium and cadmium oxide in thick film pastes used on aluminum bonded beryllium oxide.)
– Reference source: Hong Kong Trade Development Network 2009-08 Attachment File:Chinese
