| 33. 電源變壓器中，用來焊接細銅線(直徑等於或小於100μm)的焊料中所含的鉛。 | 33.Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power transformers. |
| 34. 金屬陶瓷微調電位器元素中的鉛。 | 34.Lead in cermet-based trimmer potentiometer elements. |
| 35. 專業音響設備中，光偶合器的光阻內所含的鎘。此項豁免於2009年12月31日截止。 | 35.Cadmium in photoresistors for optocouplers applied in professional audio equipment until 31 December 2009. |
| 36. 直流電漿顯示器中，用作陰極濺鍍抑制劑的汞，每台顯示器的含量不得大於30毫克。 | 36.Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to 30 mg per display
until 1 July 2010. |
| 37. 以硼酸鋅鹽玻璃為基底，高壓二極體電鍍層中所含的鉛。 | 37.Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body. |
| 38. 用於鋁及氧化鈹接合的厚膜塗料中所含的鎘和鎘氧化物。 | 38.Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide. |
